ORTEC at the AICOMP SUMMIT 2026 in Vienna
Read time: 2 MinutenThe AICOMP SUMMIT 2026 is the central event for digital innovation in the packaging industry. From 11 to 13 March 2026, packaging manufacturers and industry experts will meet in Vienna and online.
Meet ORTEC on site and learn how integrated load optimization and route planning can increase your efficiency, transparency and sustainability.
Digital Transformation in Packaging at AICOMP SUMMIT 2026
The AICOMP SUMMIT 2026 addresses the key challenges facing the packaging industry in the context of digital transformation. The focus is on complex supply chains, increasing cost pressure, growing individualisation, high quality requirements and ambitious sustainability goals.
The event will show how digital innovations create transparency, support planning and decision-making processes, and help companies transform operational complexity into controllable and sustainable processes.
Event Details
- Event: AICOMP SUMMIT
- Date: 11-13 March 2026
- Location: 25hours Hotel, Vienna, Austria
ORTEC Session at the AICOMP SUMMIT
As a knowledge-providing company, ORTEC is part of the AICOMP SUMMIT 2026 and will demonstrate how integrated load and route optimisation can sustainably improve transport planning in the packaging industry.
In many companies, load optimisation and route planning are still carried out separately. This makes it difficult to achieve optimal capacity utilisation, reduces planning quality and increases operational costs. ORTEC will demonstrate how integrated optimisation can create a consistently executable transport plan.
- Title: Master Your Moves – Strategies for intelligent load, route and transport planning
- Time: 4:45 – 5:30 pm
- Speaker: Stefan Kapitola & Marko Maurer
Stefan Kapitola